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Process for uniform deposition of tungsten silicide on semiconductor wafers by treatment of susceptor having aluminum nitride surface thereon with tungsten silicide after cleaning of susceptor

US 5,510,297 A · Assignee: Applied Materials, Inc. · Inventors: Telford; Susan et al.

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Listed from its USPTO record in Patent Yard's full-term archive. Its claims, description and drawings are in the USPTO PDF and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed August 10, 1995. A US utility patent lasts 20 years from filing, so its term ended August 10, 2015.
  • Patents filed before May 29, 2000 can't get a term adjustment for USPTO delays, and any other extension is capped at five years, so it can't still be in force.
  • We haven't checked its US family, and a later related patent could still be in force. We check US rights only.
FiledAugust 10, 1995
GrantedApril 23, 1996
Term endedAugust 10, 2015
Application number08/504294
Classification (CPC)C23C16/42 +2 more
Length5 pages

Timeline

Timeline From USPTO dates

1996199820002002200420062008201020122014Application filedAug 10, 1995Patent grantedApril 23, 1996Term endedAug 10, 2015

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