Lapsed, fee not paidUS 8,794,074 B2
Chips & Semiconductors · US 8,794,074 B2
Chips & Semiconductors
3,667 patents: 3,667 lapsed.
Patents
Lapsed, fee not paidUS 8,795,540 B2
Chips & Semiconductors · US 8,795,540 B2
Selective bias compensation for patterning steps in CMOS processes
Lapsed, fee not paidUS 8,796,058 B2
Chips & Semiconductors · US 8,796,058 B2
Semiconductor structure
Lapsed, fee not paidUS 8,796,084 B2
Chips & Semiconductors · US 8,796,084 B2
Method for removing hard masks on gates in semiconductor manufacturing process
Lapsed, fee not paidUS 8,796,088 B2
Chips & Semiconductors · US 8,796,088 B2
Semiconductor device and method of fabricating the same
Lapsed, fee not paidUS 8,796,104 B2
Chips & Semiconductors · US 8,796,104 B2
Semiconductor device and method of manufacturing the same
Lapsed, fee not paidUS 8,796,105 B2
Chips & Semiconductors · US 8,796,105 B2
Method and apparatus for preparing polysilazane on a semiconductor wafer
Lapsed, fee not paidUS 8,796,118 B2
Chips & Semiconductors · US 8,796,118 B2
Method of producing a three-dimensional integrated circuit
Lapsed, fee not paidUS 8,796,124 B2
Chips & Semiconductors · US 8,796,124 B2
Doping method in 3D semiconductor device
Lapsed, fee not paidUS 8,796,132 B2
Chips & Semiconductors · US 8,796,132 B2
System and method for forming uniform rigid interconnect structures
Lapsed, fee not paidUS 8,796,135 B2
Chips & Semiconductors · US 8,796,135 B2
Microelectronic elements with rear contacts connected with via first or via middle structures
Lapsed, fee not paidUS 8,796,143 B2
Chips & Semiconductors · US 8,796,143 B2
Semiconductor device and manufacturing method thereof
Lapsed, fee not paidUS 8,796,144 B2
Chips & Semiconductors · US 8,796,144 B2
Method of forming thin film interconnect and thin film interconnect
Lapsed, fee not paidUS 8,796,537 B2
Chips & Semiconductors · US 8,796,537 B2
Carbon nanotube based solar cell
Lapsed, fee not paidUS 8,796,666 B1
Chips & Semiconductors · US 8,796,666 B1
MOS devices with strain buffer layer and methods of forming the same
Lapsed, fee not paidUS 8,796,671 B2
Chips & Semiconductors · US 8,796,671 B2
Organic light emitting diode display and method of manufacturing the same
Lapsed, fee not paidUS 8,796,674 B2
Chips & Semiconductors · US 8,796,674 B2
Method of manufacturing organic electronic device, and organic electronic device
Lapsed, fee not paidUS 8,796,698 B2
Chips & Semiconductors · US 8,796,698 B2
Method for fabricating substrate with nano structures, light emitting device and manufacturing method thereof
Lapsed, fee not paidUS 8,796,703 B2
Chips & Semiconductors · US 8,796,703 B2
Display device capable of emitting light from opposite sides
Lapsed, fee not paidUS 8,796,709 B2
Chips & Semiconductors · US 8,796,709 B2
Housing for high-power LEDs
Lapsed, fee not paidUS 8,796,718 B2
Chips & Semiconductors · US 8,796,718 B2
Light emitting element and method for manufacturing light emitting element
Lapsed, fee not paidUS 8,796,724 B2
Chips & Semiconductors · US 8,796,724 B2
Light emitting systems and methods
This invention is about a reliable light-emitting system and a method to make it.
Lapsed, fee not paidUS 8,796,748 B2
Chips & Semiconductors · US 8,796,748 B2
Transistors, methods of manufacture thereof, and image sensor circuits
Lapsed, fee not paidUS 8,796,766 B2
Chips & Semiconductors · US 8,796,766 B2
Semiconductor device and method for fabricating the same
Lapsed, fee not paidUS 8,796,780 B2
Chips & Semiconductors · US 8,796,780 B2
Semiconductor device and manufacturing method thereof
Lapsed, fee not paidUS 8,796,804 B2
Chips & Semiconductors · US 8,796,804 B2
Forming sensing elements above a semiconductor substrate
Lapsed, fee not paidUS 8,796,805 B2
Chips & Semiconductors · US 8,796,805 B2
Multiple metal film stack in BSI chips
Lapsed, fee not paidUS 8,796,807 B2
Chips & Semiconductors · US 8,796,807 B2
Temperature monitoring in a semiconductor device by using a PN junction based on silicon/germanium materials
Lapsed, fee not paidUS 8,796,843 B1
Chips & Semiconductors · US 8,796,843 B1
RF and milimeter-wave high-power semiconductor device
Lapsed, fee not paidUS 8,796,853 B2
Chips & Semiconductors · US 8,796,853 B2
Metallic capped interconnect structure with high electromigration resistance and low resistivity
Lapsed, fee not paidUS 8,796,856 B2
Chips & Semiconductors · US 8,796,856 B2
Semiconductor device and manufacturing method thereof
Lapsed, fee not paidUS 8,796,869 B2
Chips & Semiconductors · US 8,796,869 B2
Semiconductor device and method of manufacturing the same
Lapsed, fee not paidUS 8,797,303 B2
Chips & Semiconductors · US 8,797,303 B2
Amorphous oxide semiconductor thin film transistor fabrication method
Lapsed, fee not paidUS 11,401,156 B2
Chips & Semiconductors · US 11,401,156 B2
Micro-electro-mechanical system silicon on insulator pressure sensor and method for preparing same
Lapsed, fee not paidUS 11,402,579 B2
Chips & Semiconductors · US 11,402,579 B2
Techniques for fabricating waveguide facets and die separation
Lapsed, fee not paidUS 11,404,288 B1
Chips & Semiconductors · US 11,404,288 B1
Semiconductor device packaging warpage control
Lapsed, fee not paidUS 11,404,345 B2
Chips & Semiconductors · US 11,404,345 B2
Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path
Lapsed, fee not paidUS 11,404,349 B2
Chips & Semiconductors · US 11,404,349 B2
Multi-chip packages and sinterable paste for use with thermal interface materials
Lapsed, fee not paidUS 11,404,399 B2
Chips & Semiconductors · US 11,404,399 B2
Chip transfer substrate, chip transfer device and chip transfer method
Lapsed, fee not paidUS 11,404,407 B2
Chips & Semiconductors · US 11,404,407 B2
Implants to enlarge Schottky diode cross-sectional area for lateral current conduction
Lapsed, fee not paidUS 11,404,489 B2
Chips & Semiconductors · US 11,404,489 B2
Display substrate capable of alleviating color separation, and display device
Lapsed, fee not paidUS 11,404,507 B2
Chips & Semiconductors · US 11,404,507 B2
Display substrate, method for manufacturing the same, and display device
Lapsed, fee not paidUS 11,404,575 B2
Chips & Semiconductors · US 11,404,575 B2
Diverse transistor channel materials enabled by thin, inverse-graded, germanium-based layer
Lapsed, fee not paidUS 11,404,585 B2
Chips & Semiconductors · US 11,404,585 B2
Semiconductor device and method for manufacturing semiconductor device
Lapsed, fee not paidUS 11,404,622 B2
Chips & Semiconductors · US 11,404,622 B2
Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate
Lapsed, fee not paidUS 11,404,623 B2
Chips & Semiconductors · US 11,404,623 B2
Method of manufacturing bulk type thermoelectric element
Lapsed, fee not paidUS 11,404,630 B2
Chips & Semiconductors · US 11,404,630 B2
Perpendicular spin transfer torque memory (pSTTM) devices with enhanced stability and method to form same
Lapsed, fee not paidUS 11,404,639 B2
Chips & Semiconductors · US 11,404,639 B2
Selector devices with integrated barrier materials
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