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Method for pre-soldering metal surfaces onto metalized substrates using a metallic gauze, metalized substrates with a solder layer which has a superficial structure of a gauze

US 2015/0298232 A1 · Inventors: Herrmann; Klaus

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Listed from its USPTO record in Patent Yard's full-term archive. Its claims, description and drawings are in the USPTO PDF and on Google Patents, and the Claude kit works from them.

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  • Published October 22, 2015, and no patent has issued anywhere in its US family since.
  • Nothing has been filed in its family for more than seven years, so it is very unlikely to still be pending.
  • This status is inferred from USPTO records. Confirm it on Patent Center before relying on it.
FiledDecember 13, 2013
PublishedOctober 22, 2015
StatusAbandoned (inferred)
Application number14/650020
Classification (CPC)B23K1/0016 +2 more
Length6 pages

Timeline

Timeline From USPTO dates

20142015Application filedDec 13, 2013Application publishedOct 22, 2015

Sources & verification

Official USPTO records

Full published documentText and every drawing sheet as a PDF.USPTOFile historyStatus, office actions, notices, fee records and petitions.USPTO Patent CenterPatent Public Search recordSearchable full text and bibliographic data.USPTO

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Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comJustia PatentsFull text, claims and classification.patents.justia.comFreePatentsOnlineFull text and PDF.freepatentsonline.comEspacenetForeign family and legal status.European Patent Office

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