Patent Yard Sign in
Likely abandonedArchive

Method for producing coil element using resin substrate and using electroforming

US 2015/0294789 A1 · Assignee: LEAP CO., LTD. · Inventors: Sano; Takashi et al.

USPTO PDF

Overview

The published document from the USPTO: abstract, claims, description and drawings. Open it full size

Read the whole patent

Listed from its USPTO record in Patent Yard's full-term archive. Its claims, description and drawings are in the USPTO PDF and on Google Patents, and the Claude kit works from them.

Google PatentsUSPTO PDF

Why it's free to use

  • Published October 15, 2015, and no patent has issued anywhere in its US family since.
  • Nothing has been filed in its family for more than seven years, so it is very unlikely to still be pending.
  • This status is inferred from USPTO records. Confirm it on Patent Center before relying on it.
FiledOctober 30, 2012
PublishedOctober 15, 2015
StatusAbandoned (inferred)
Application number14/438960
Classification (CPC)H01F41/041 +2 more
Length10 pages

Timeline

Timeline From USPTO dates

201320142015Application filedOct 30, 2012Application publishedOct 15, 2015

Sources & verification

Official USPTO records

Full published documentText and every drawing sheet as a PDF.USPTOFile historyStatus, office actions, notices, fee records and petitions.USPTO Patent CenterPatent Public Search recordSearchable full text and bibliographic data.USPTO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comJustia PatentsFull text, claims and classification.patents.justia.comFreePatentsOnlineFull text and PDF.freepatentsonline.comEspacenetForeign family and legal status.European Patent Office

Everything on this page comes from the USPTO record linked above.