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Bonding apparatus

US 2005/0274771 A1 · Assignee: Kabushiki Kaisha Shinkawa · Inventors: Kakutani, Osamu et al.

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Overview

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Listed from its USPTO record in Patent Yard's full-term archive. Its claims, description and drawings are in the USPTO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Published December 15, 2005, and no patent has issued anywhere in its US family since.
  • Nothing has been filed in its family for more than seven years, so it is very unlikely to still be pending.
  • This status is inferred from USPTO records. Confirm it on Patent Center before relying on it.
FiledJune 10, 2005
PublishedDecember 15, 2005
StatusAbandoned (inferred)
Application number11/150415
Classification (CPC)B23K20/004 +2 more
Length12 pages

Timeline

Timeline From USPTO dates

Application filedJune 10, 2005Application publishedDec 15, 2005

Sources & verification

Official USPTO records

Full published documentText and every drawing sheet as a PDF.USPTOFile historyStatus, office actions, notices, fee records and petitions.USPTO Patent CenterPatent Public Search recordSearchable full text and bibliographic data.USPTO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comJustia PatentsFull text, claims and classification.patents.justia.comFreePatentsOnlineFull text and PDF.freepatentsonline.comEspacenetForeign family and legal status.European Patent Office

Everything on this page comes from the USPTO record linked above.