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High modulus label with compliant carrier sheet

US 2005/0238834 A1 · Assignee: Eastman Kodak Company · Inventors: Bourdelais, Robert P. et al.

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Overview

The published document from the USPTO: abstract, claims, description and drawings. Open it full size

Read the whole patent

Listed from its USPTO record in Patent Yard's full-term archive. Its claims, description and drawings are in the USPTO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Published October 27, 2005, and no patent has issued anywhere in its US family since.
  • Nothing has been filed in its family for more than seven years, so it is very unlikely to still be pending.
  • This status is inferred from USPTO records. Confirm it on Patent Center before relying on it.
FiledApril 21, 2004
PublishedOctober 27, 2005
StatusAbandoned (inferred)
Application number10/828779
Classification (CPC)G03C11/14 +2 more
Length15 pages

Timeline

Timeline From USPTO dates

2005Application filedApril 21, 2004Application publishedOct 27, 2005

Sources & verification

Official USPTO records

Full published documentText and every drawing sheet as a PDF.USPTOFile historyStatus, office actions, notices, fee records and petitions.USPTO Patent CenterPatent Public Search recordSearchable full text and bibliographic data.USPTO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comJustia PatentsFull text, claims and classification.patents.justia.comFreePatentsOnlineFull text and PDF.freepatentsonline.comEspacenetForeign family and legal status.European Patent Office

Everything on this page comes from the USPTO record linked above.