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European application, no grantEurope

Equipment for wafer bonding

EP 1815500 A2 · Applicant: Applied Microengineering Limited

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Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Google PatentsEPO PDF

Why it's free to use

  • Filed October 10, 2005 and never granted as a European patent. Had it been granted, its 20-year term would have ended October 10, 2025.
  • Supplementary protection certificates extend only medicine and crop-protection patents, and it isn't classified as either.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledOctober 10, 2005
PublishedAugust 8, 2007
GrantedNever granted
Term endedOctober 10, 2025
Application numberEP 05791378
Classification (CPC)H10P10/128 +2 more

Timeline

Timeline From EPO dates

2006200820102012201420162018202020222024Application filedOct 10, 2005PublishedAug 8, 2007Term endedOct 10, 2025

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.