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Expired European patentEurope

Method for measuring amount of strain of bonded strained wafer

EP 1705705 B1 · Applicant: SHIN-ETSU HANDOTAI COMPANY LIMITED

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed January 11, 2005 and granted December 23, 2009. A European patent lasts at most 20 years from filing, so its term ended January 11, 2025.
  • Supplementary protection certificates extend only medicine and crop-protection patents, and it isn't classified as either.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledJanuary 11, 2005
PublishedSeptember 27, 2006
GrantedDecember 23, 2009
Term endedJanuary 11, 2025
Application numberEP 05703404
Classification (CPC)G01N23/207

Timeline

Timeline From EPO dates

2006200820102012201420162018202020222024Application filedJan 11, 2005PublishedSep 27, 2006Patent grantedDec 23, 2009Term endedJan 11, 2025

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

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Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

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