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European application, no grantEurope

Heat conductive substrate press-mounted in printed circuit board hole for transferring heat from integrated circuit to heat sink

EP 1496546 A2 · Applicant: Hewlett-Packard Company

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Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed September 23, 1998 and never granted as a European patent. Had it been granted, its 20-year term would have ended September 23, 2018.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by March 23, 2024.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledSeptember 23, 1998
PublishedJanuary 12, 2005
GrantedNever granted
Term endedSeptember 23, 2018
Application numberEP 04076633
Classification (CPC)H10W40/228 +2 more

Timeline

Timeline From EPO dates

1999200120032005200720092011201320152017Application filedSep 23, 1998PublishedJan 12, 2005Term endedSep 23, 2018

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.