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Expired European patentEurope

Resilient interconnect structure for electronic components and method for making the same

EP 1200992 B1 · Applicant: FormFactor, Inc.

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Overview

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed December 27, 2000 and granted October 29, 2008. A European patent lasts at most 20 years from filing, so its term ended December 27, 2020.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by June 27, 2026.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledDecember 27, 2000
PublishedMay 2, 2002
GrantedOctober 29, 2008
Term endedDecember 27, 2020
Application numberEP 00990371
Classification (CPC)G01R1/06761 +2 more

Timeline

Timeline From EPO dates

2001200320052007200920112013201520172019Application filedDec 27, 2000PublishedMay 2, 2002Patent grantedOct 29, 2008Term endedDec 27, 2020

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.