Patent Yard Sign in
Expired European patentEurope

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus

EP 1094499 B1 · Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

EPO PDF

Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

Read the whole patent

Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Google PatentsEPO PDF

Why it's free to use

  • Filed October 19, 2000 and granted July 1, 2009. A European patent lasts at most 20 years from filing, so its term ended October 19, 2020.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by April 19, 2026.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledOctober 19, 2000
PublishedApril 25, 2001
GrantedJuly 1, 2009
Term endedOctober 19, 2020
Application numberEP 00122813
Classification (CPC)H10P72/50 +1 more

Timeline

Timeline From EPO dates

2001200320052007200920112013201520172019Application filedOct 19, 2000PublishedApril 25, 2001Patent grantedJuly 1, 2009Term endedOct 19, 2020

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.