Patent Yard Sign in
Expired European patentEurope

Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer

EP 1037262 B1 · Applicant: MITSUBISHI MATERIALS CORPORATION

EPO PDF

Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

Read the whole patent

Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed March 15, 2000 and granted October 24, 2007. A European patent lasts at most 20 years from filing, so its term ended March 15, 2020.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by September 15, 2025.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledMarch 15, 2000
PublishedSeptember 20, 2000
GrantedOctober 24, 2007
Term endedMarch 15, 2020
Application numberEP 00105312
Classification (CPC)B24B53/017 +1 more

Timeline

Timeline From EPO dates

2001200320052007200920112013201520172019Application filedMarch 15, 2000PublishedSep 20, 2000Patent grantedOct 24, 2007Term endedMarch 15, 2020

Sources & verification