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Expired European patentEurope

Method for material removing machining of a wafer edge

EP 0881035 B1 · Applicant: Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft

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Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed September 4, 1997 and granted October 27, 1999. A European patent lasts at most 20 years from filing, so its term ended September 4, 2017.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by March 4, 2023.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledSeptember 4, 1997
PublishedDecember 2, 1998
GrantedOctober 27, 1999
Term endedSeptember 4, 2017
Application numberEP 97115333
Classification (CPC)B24B27/0076 +2 more

Timeline

Timeline From EPO dates

1998200020022004200620082010201220142016Application filedSep 4, 1997PublishedDec 2, 1998Patent grantedOct 27, 1999Term endedSep 4, 2017

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