Interconnect structure having reduced peak localized current density and method of fabricating an interconnect level in a semiconductor device

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Why it's free to use

• Filed July 17, 1995 and never granted as a European patent. Had it been granted, its 20-year term would have ended July 17, 2015.
• A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by January 17, 2021.
• We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.