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European application, no grantEurope

Process for deposition of a tungsten layer on a semiconductor wafer

EP 0689232 A2 · Applicant: APPLIED MATERIALS INC.

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Overview

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed August 24, 1990 and never granted as a European patent. Had it been granted, its 20-year term would have ended August 24, 2010.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by February 24, 2016.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledAugust 24, 1990
PublishedDecember 27, 1995
GrantedNever granted
Term endedAugust 24, 2010
Application numberEP 95114145
Classification (CPC)H10P14/412 +2 more

Timeline

Timeline From EPO dates

1991199319951997199920012003200520072009Application filedAug 24, 1990PublishedDec 27, 1995Term endedAug 24, 2010

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.