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Expired European patentEurope

Method for dividing a semiconductor wafer comprising a semiconductor layer and a metal layer into chips

EP 0499752 B1 · Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

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Overview

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed December 30, 1991 and granted June 12, 1996. A European patent lasts at most 20 years from filing, so its term ended December 30, 2011.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by June 30, 2017.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledDecember 30, 1991
PublishedAugust 26, 1992
GrantedJune 12, 1996
Term endedDecember 30, 2011
Application numberEP 91312090
Classification (CPC)H10P52/00 +1 more

Timeline

Timeline From EPO dates

1992199419961998200020022004200620082010Application filedDec 30, 1991PublishedAug 26, 1992Patent grantedJune 12, 1996Term endedDec 30, 2011

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

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