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Method for bonding silicon wafers together, for manufacturing semiconductor devices

EP 0366208 A2 · Applicant: SGS-THOMSON MICROELECTRONICS S.r.l.

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Overview

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed October 26, 1989 and never granted as a European patent. Had it been granted, its 20-year term would have ended October 26, 2009.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by April 26, 2015.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledOctober 26, 1989
PublishedMay 2, 1990
GrantedNever granted
Term endedOctober 26, 2009
Application numberEP 89202692
Classification (CPC)H10P10/128 +1 more

Timeline

Timeline From EPO dates

1990199219941996199820002002200420062008Application filedOct 26, 1989PublishedMay 2, 1990Term endedOct 26, 2009

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.