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Expired European patentEurope

Method and apparatus for adhering a tape or sheet to a semiconductor wafer

EP 0193159 B1 · Applicant: FUJITSU LIMITED

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Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

Read the whole patent

Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed February 25, 1986 and granted May 6, 1992. A European patent lasts at most 20 years from filing, so its term ended February 25, 2006.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by August 25, 2011.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledFebruary 25, 1986
PublishedSeptember 3, 1986
GrantedMay 6, 1992
Term endedFebruary 25, 2006
Application numberEP 86102397
Classification (CPC)H10P72/74 +1 more

Timeline

Timeline From EPO dates

1987198919911993199519971999200120032005Application filedFeb 25, 1986PublishedSep 3, 1986Patent grantedMay 6, 1992Term endedFeb 25, 2006

Sources & verification