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Expired European patentEurope

Dense mounting of semiconductor chip packages

EP 0089248 B1 · Applicant: FUJITSU LIMITED

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Overview

The published document from the EPO: abstract, claims, description and drawings. Open it full size

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Listed from its EPO record in Patent Yard's archive of European patents past their term. Its claims, description and drawings are in the EPO PDF and on Google Patents, and the Claude kit works from them.

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Why it's free to use

  • Filed March 17, 1983 and granted May 31, 1989. A European patent lasts at most 20 years from filing, so its term ended March 17, 2003.
  • A supplementary protection certificate, which can extend a medicine or crop-protection patent, adds at most five and a half years, so even that would have ended by September 17, 2008.
  • We check European rights only. A US or other national patent in its family could still be in force: check its family on Espacenet or Google Patents.
FiledMarch 17, 1983
PublishedSeptember 21, 1983
GrantedMay 31, 1989
Term endedMarch 17, 2003
Application numberEP 83301503
Classification (CPC)H10W70/657 +2 more

Timeline

Timeline From EPO dates

1984198619881990199219941996199820002002Application filedMarch 17, 1983PublishedSep 21, 1983Patent grantedMay 31, 1989Term endedMarch 17, 2003

Sources & verification

Official EPO records

Full published documentClaims, description and drawings as a PDF.EPOEuropean Patent RegisterProcedure, status, file inspection and legal events.EPOLinked open EP data recordThe bibliographic record this page is built from.EPO

Cross-check elsewhere

Google PatentsFull text, worldwide family, citing patents and legal events.patents.google.comEspacenetNational family members and their legal status.European Patent Office

Everything on this page comes from the EPO record linked above. EPO data used under CC BY 4.0.