Device package and methods for the fabrication and testing thereof

Abstract From the Canadian patent

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures methods of detecting leakage in a sealed device package sealed device packages, device …