Semiconductor substrate having copper/diamond composite material and method of making same
CA 2800957 C · Owner: Kyocera America, Inc. · Inventors: Mccoy, John Washington
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon lead frame insulators mounted thereon adjacent the die and a plurality of leads mounted on the insulators and electrically coupled to the die by bond wires. The substrate includes a body having opposite surfaces comprising pure copper layers and with the body interior being at least partially comprised of a copper/diamond composite so as to act as a heat spreader and provide improved heat removal and low thermal expansion as well as an electrical connection for the die. The body may be entirely comprised of a copper/diamond composite or it may be comprised of a …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 24, 2003 and granted March 17, 2015. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 24, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 24, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.