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Canadian application, no grantCanada

Metallic material for electronic components, method of working and process for producing thereof

CA 2670068 A1 · Owner: Ueno, Takashi · Inventors: Ueno, Takashi

CIPO record

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Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

The metallic material consists of an alloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0. 1 to 3. 0% by weight. In the metallic material Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed September 3, 2003. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 3, 2023.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 3, 2025.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledSeptember 3, 2003
GrantedNo grant recorded
Term endedSeptember 3, 2023
Patent numberCA 2670068 A1
Classification (IPC)C22C9/00 +2 more

Timeline

Timeline From CIPO dates

2004200620082010201220142016201820202022Application filedSep 3, 2003Term endedSep 3, 2023

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.