Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
CA 2660875 C · Owner: Murai, Hikari · Inventors: Takeda, Yoshiyuki; Kamoshida, Shinichi; Kakitani, Minoru
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component (B) 10 to 25 parts by weight of a polycondensation product of a phenol a compound having a triazine ring and an aldehyde and (C) to 45 parts by weight of an epoxy resin based on 100 parts by weight of the total amount of organic solid components of Components (A) (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000 or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 10, 2002 and granted March 19, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 10, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 10, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.