Led packaging method and packaged led
CA 2634288 A1 · Owner: Lednium Pty Ltd · Inventors: Jeganathan, Balu; Montagnat, John Albert
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An LED packaging method, including: forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region; forming an electrical insulator on the peripheral region; forming an electrically conductive material on the electrical insulator;, mounting a semiconductor die directly to the base within the receptacle the, die incorporating at least one light emitting diode (LED); and forming one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die to provide a packaged LED.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 11, 2003. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 11, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 11, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.