Bending-type rigid printed wiring board and process for producing the same
CA 2616793 C · Owner: Hatakeyama, Yoshifumi · Inventors: Takemura, Yasuo; Terunuma, Ichiro; Harada, Hiroshi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties) can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard core material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further a conductor layer (4) …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 28, 2006 and granted October 1, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended July 28, 2026.
- Certificates of supplementary protection extend only drug patents, and it isn't classified as one.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.