Thinning of a si wafer for mems-sensors applications
CA 2610693 C · Owner: Tilli, Markku · Inventors: Makinen, Jari; Tilli, Markku; Lempinen, Vesa-Pekka
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for thinning a wafer layer to a predetermined thickness comprises two phases of thinning. A first thinning phase and a second thinning phase wherein the first thinning phase is a preparatory thinning phase and the second thinning phase is a final thinning phase so performed that the , structure comprising silicon meets as thinned the final thickness as predetermined. Such thinned layer in a wafer for instance can be used in a , sensor to be used in normal sized micromechanical or even nano-sized devices for the device specific sensing applications in electro-mechanical devices.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 30, 2006 and granted July 14, 2015. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 30, 2026.
- Certificates of supplementary protection extend only drug patents, and it isn't classified as one.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.