Magnetic self-assembly for integrated circuit packages
CA 2600611 C · Owner: Sensormatic Electronics Corporation · Inventors: Shafer, Gary Mark; Reynolds, George Anthony, Jr.; Lian, Ming-Ren
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region and a first magnetic , material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 28, 2006 and granted June 5, 2012. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 28, 2026.
- Certificates of supplementary protection extend only drug patents, and it isn't classified as one.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.