Solder alloy

Abstract From the Canadian patent

An alloy suitable for use in a wave solder process reflow soldering process, hot air levelling process or a ball grid array the alloy comprising from 0.08 , - 3 wt.% bismuth from 0.15 - 1.5 wt.% copper, from 0.1 - 1.5 wt.% silver from 0 - 0.1 wt.% phosphorus, from 0 - 0.1 wt.% germanium from 0 - 0.1 wt.% , gallium, from 0 - 0.3 wt.% of one or more rare earth elements from 0 - 0.3 , wt.% indium, from 0 - 0.3 wt.% magnesium from 0 - 0.3 wt.% calcium, from 0 - , 0.3 wt.% silicon from 0 - 0.3 wt.% aluminium, from 0 - 0.3 wt.% zinc and at , least one of the following elements from 0.02 - 0.3 wt% nickel from 0.008 - , 0.2 wt% manganese, from 0.01 - 0.3 wt% cobalt from 0.01 - 0.3 wt% chromium, …