Method for welding wafer sheets and product so obtained
CA 2584807 C · Owner: Mansuino, Sergio · Inventors: Mansuino, Sergio
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Method for welding wafer sheets and product so obtained A method for welding wafer sheet parts along reciprocal mat- ing surfaces in which the parts are , welded to each other by the moistening of the mating surfaces and adhesion by contact of said surfaces. Moistening is preferably carried out using water alone nebulised onto the mating surfaces. The method is particularly applicable to industrial production of wafer sheet shells formed by mating , two half-shells together rim to rim.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 13, 2005 and granted April 16, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 13, 2025.
- Certificates of supplementary protection extend only drug patents, and it isn't classified as one.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.