Thermal interface material and solder preforms
CA 2547358 C · Owner: Laughlin, John P. · Inventors: Lewis, Brian; Kyaw, David V.; Singh, Bawa
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A solder preform (5,12) having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. Among the fillers are CTE modifying components and/or a thermal conductivity enhancement components.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 25, 2003 and granted August 6, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 25, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 25, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.