Semiconductor package and method of manufacturing the same
CA 2536799 C · Owner: Isokawa, Toshihiko · Inventors: Hirafune, Sayaka; Shiotani, Koichi; Suemasu, Tatsuo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A semiconductor package includes a semiconductor element having a circuit element arranged on a first surface of a semiconductor substrate; an external wiring region arranged on a second surface of the semiconductor substrate; a support substrate arranged on the first surface of the semiconductor substrate; an electrode pad arranged on the first surface of the semiconductor substrate; and a through electrode reaching from the electrode pad to the second surface of the semiconductor substrate.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 25, 2004 and granted November 12, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended August 25, 2024.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 25, 2026.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.