Room temperature metal direct bonding
CA 2515375 C · Owner: Tong, Qin-Yi · Inventors: Enquist, Paul M.; Rose, Anthony Scot; Tong, Qin-Yi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit and having , a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads preferably connected to a , device or circuit and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate and a contact-bonded interface , between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 6, 2004 and granted September 24, 2013. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 6, 2024.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 6, 2026.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.