Adhesive preparation package
CA 2511166 C · Owner: Nitto Denko Corporation · Inventors: Ninomiya, Kazuhisa; Goshima, Shoji
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention provides an adhesive preparation package containing an adhesive preparation and a packaging film(s) enclosing said preparation the packaging films being heat-sealed around the adhesive preparation wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion and a flat heat-sealed portion and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 29, 2005 and granted December 4, 2012. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 29, 2025.
- Certificates of supplementary protection extend only drug patents, and it isn't classified as one.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.