Group iii nitride based flip-chip integrated circuit and method for fabricating
CA 2511005 C · Owner: Cree, Inc. · Inventors: Parikh, Primit; Wu, Yifeng; Mishra, Umesh K.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A flip-chip integrated circuit and method for fabricating the integrated circuit are disclosed. A method according to the invention comprises forming a plurality of active semiconductor devices on a wafer and separating the active semiconductor devices. Passive components and interconnections are formed on a surface of a circuit substrate and at least one conductive via is formed through the circuit substrate. At least one of the active semiconductor devices is flip-chip mounted on the circuit substrate with at least one of the bonding pads in electrical contact with one of the conductive vias. A flip-chip integrated circuit according to the present invention comprises a circuit …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 23, 2003 and granted May 17, 2016. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended December 23, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 23, 2025.
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Timeline
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Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.