Method for producing a packaged integrated circuit with a microcavity
CA 2503577 A1 · Owner: Landsberger, Leslie M. · Inventors: Grudin, Oleg; Landsberger, Leslie M.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
There is described a method for producing a packaged integrated circuit. The method comprises a first step of building an integrated circuit having a microstructure suspended above a micro-cavity and having a heating element on the , micro-structure capable of heating itself and its immediate surroundings. A layer of protective material is then deposited on said micro-structure such that at least a top surface of the micro-structure and an opening of the microcavity is covered, wherein the protective material is in a solid state at room temperature and can protect the micro-structure during silicon wafer dicing procedures and subsequent packaging. The integrated circuit is packaged and …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 27, 2003. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended October 27, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 27, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.