Electropolishing and electroplating methods
CA 2479873 A1 · Owner: Wang, Hui · Inventors: Yih, Peihaur; Wu, Huiquan; Wang, Jian
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In one aspect of the present invention an exemplary method is provided for , electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recessed region within a first current density range before the metal layer is planar above recessed regions of a first density and , electroplating within a second current density range after the metal layer is planar above the recessed regions. The second current density range is greater than the first current density range. In one example the method further , includes electroplating in the second current density range until the metal layer is planar above …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 11, 2003. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended April 11, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 11, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.