Tin-zinc lead-free solder, its mixture, and solder-joined part
CA 2466949 A1 · Owner: Tanaka, Hirotaka · Inventors: Aoyama, Haruo; Yoshikawa, Masaaki; Tanaka, Hirotaka
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A tin-zinc lead-free solder contains tin as a main component and essentially at least 6-10 weight% of zinc. A protective film of magnesium oxide is formed on the surface of the solder. The solder also contains 0.0015 to 0.1 weight% of magnesium, at which percentage the oxide protective film can be broken when the solder is melted. While a paste of this solder is stored the magnesium , oxide protective film formed on the solder particles protects the inside of the solder particles and suppresses the reaction between the zinc and an activator to prolong the shelf life. The oxide protective film is subject to breakage when the solder is heated and melted to maintain the favorable …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 18, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 18, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 18, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.