Low read-through epoxy-bonded smc
CA 2466063 A1 · Owner: Lord Corporation · Inventors: Pugne, David R.; Damico, Dennis J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
What is disclosed is a 2-part epoxy adhesive composition which comprises an epoxy compound, an optional amine hardener optional hydroxy-substituted , aromatic compound and from 20% to 60% of the total weight of adhesive combined of liquid terminal epoxy reactive groups and amidoamine whereby the , adhesive is applied as a mixture of first and second parts in a volume ration of the first epoxy part: second cure part of 1:1.4 to 1:3Ø The adhesive is adapted to provide bonding of SMC with low or no read-through initial and , aged fiber tearing bonds and specified bond strength minimum at 400 ~F (204 ~C).
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 13, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 13, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 13, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.