Contact planarization materials that generate no volatile byproducts or residue during curing

Abstract From the Canadian patent

The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization process. The materials can be hardened by photoorradiation or by heat during the planirization process and they include one , or more types of monomers oligomers, or mixtures thereof, an optional crosslinker, and an optional organic reactive solvents. The solvent if used, is , chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications microelectromechanical …