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Canadian application, no grantCanada

High pressure processing chamber for multiple semiconductor substrates

CA 2462429 A1 · Owner: Layman, Frederick P. · Inventors: Layman, Frederick P.; Biberger, Maximilian A.

CIPO record

Overview

Drawings and full text

Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

A high pressure processing chamber for processing multiple semiconductor substrates I comprises a chamber housing a cassette, and a chamber closure. , The cassette is removably coupled to the chamber housing. The cassette is configured to accommodate at least two semiconductor substrates. The chamber closure is coupled to the chamber housing. The chamber closure is configured such that in operation the chamber closure seals with the chamber housing to provide an enclosure for high pressure processing of the semicon ductor substrates.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed October 3, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended October 3, 2022.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 3, 2024.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledOctober 3, 2002
GrantedNo grant recorded
Term endedOctober 3, 2022
Patent numberCA 2462429 A1
Classification (IPC)H01L21/00 +2 more

Timeline

Timeline From CIPO dates

2003200520072009201120132015201720192021Application filedOct 3, 2002Term endedOct 3, 2022

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.