Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring board
CA 2462130 C · Owner: Tsukamoto, Takehito · Inventors: Sakaki, Yuichi; Maehara, Masataka; Ode, Masayuki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multi-layer circuit wiring board comprising a laminate of films (131a, 131b, 131c), each film having a wiring pattern (17a, 17b, 21, 23) formed on at least one surface thereof, wherein the wiring pattern formed on each film is electrically connected with the wiring pattern (17a, 17b, 21, 23) formed on another film (131a, 131b, 131c) which is disposed neighboring thereto through a via-contact layer (19a 19b) provided, on any one of the neighboring films.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 30, 2002 and granted November 27, 2012. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended September 30, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 30, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.