Method of ablating an opening in a hard, non-metallic substrate
CA 2451077 A1 · Owner: Virtek Laser Systems, Inc. · Inventors: Archibald, Cec; Glover, Ruiz; Cummings, Mike
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of ablating a hole into a hard non-metallic substrate(24) is , disclosed. At least on laser assembly (12) capable of generating a laser beam (16a) in an axis having a focus that is moveable relative to the axis is provided. A focus of the laser beam (16a) is positioned adjacent at least one surface of the substrate (24). A first layer (Pass-1) of the substrate (24) is ablated by the laser beam (16a). The focus is moved relative to the axis corresponding to the depth of the substrate (24) thereby enabling ablation of successive layers (Pass 2-10) of the substrate (24) are ablated to generate a hole (32) into the substrate (24).
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 2, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 2, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 2, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.