Polyimide adhesion enhancement to polyimide film
CA 2441103 A1 · Owner: Zimmerman, Scott M. · Inventors: Skorupski, Edward C.; Zimmerman, Scott M.; Smith, Gordon C.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly the present invention , pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil coated with a polyimide film is laminated onto an etched surface of a polyimide substrate. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 11, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 11, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 11, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.