Viscous protective overlayers for planarization of integrated circuits
CA 2435623 A1 · Owner: Debear, Donald · Inventors: Levert, Joseph; Mukherjee, Shyama; Debear, Donald
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention relates to the planarization of surfaces as typically encountered in the fabrication of integrated circuits particularly copper , conductors and Ta/TaN barrier layers encountered in damascene and dual damascene interconnects. The present invention describes planarization methods for Cu/Ta/TaN interconnects, typically making use of a viscous overlayer (13) tending to dwell in regions of lower surface topography (8 9, 10), protecting , said lower regions from etching by a combination of chemical and mechanical effects. In some embodiments, the viscous overlayer contains species that hinder removal of copper from regions of the surface in contact with the viscous …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 22, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended January 22, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 22, 2024.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.