Method for making a multilevel circuitry comprising conductor tracks and micro-vias
CA 2433222 A1 · Owner: Lorentz, Vincent · Inventors: Lorentz, Vincent; Cassat, Robert
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention concerns a method for making an multilevel interconnection circuitry comprising conductor tracks and micro-vias. The method for producing at least one of the levels comprises the following steps: a) on a substrate including at its surface metallizable and/or potentially metallizable parts (102) forming a first insulating photosensitive resin layer (103) comprising a compound capable of inducing subsequent metallization; b) exposing and revealing the first layer (103) so as to selectively uncover the metallizable and/or potentially metallizable parts (102) of the substrate; c) forming by metallization, metal conductor tracks (111) and micro-vias (110) at the surface of the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 24, 2001. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 24, 2021.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 24, 2023.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.