Electronic module assembly apparatus, methods and articles of manufacture
CA 2420165 A1 · Owner: Tyco Electronics Corporation · Inventors: Kane, Vincent Michael; Foltz, Keith Richard
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Apparatus, methods and articles of manufacture for electronic module assemblies are shown, comprising a pin organizer installed after a header is assembled, to a module. Opposing forces tension the organizer header and module , assembly, so, as to provide a relatively fixed anchor for the header upon the module as , well as, providing orientation for the module and support for a pin array.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 26, 2003. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended February 26, 2023.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 26, 2025.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.