Method for making a circuitry comprising conductive tracks, chips and micro-vias and use of same for producing printed circuits and multilayer modules with high density of integration
CA 2417159 A1 · Owner: Cassat, Robert · Inventors: Cassat, Robert; Lorentz, Vincent
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention concerns a method for making a circuitry comprising conductive tracks chips and micro-vias, at the top surface of a dielectric (303) consisting of a polymer matrix a compound capable of inducing subsequent metallization and if required one or several non-conductive and inert fillers said dielectric (303) covering a level of circuitry (302) or metallized layer which comprises steps which consist in: a) perforating right through said dielectric (303) without perforating the subjacent metallized layer or the subjacent level of circuitry (302) so as to form one or several micro-vias (304) at desired sites; b) forming by metallization, metal tracks (312), chips (313) and micro-vias …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 26, 2001. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 26, 2021.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 26, 2023.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.