Resin composition for insulation material, resin composition for adhesive and adhesion sheet
CA 2413759 A1 · Owner: Hasegawa, Toshiyuki · Inventors: Iyama, Hironobu; Naitoh, Shigeki; Hasegawa, Toshiyuki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An insulating resin composition excellent in resistance to soldering heat characterized by containing (A) a copolymer comprising vinyl monomer units a and epoxy monomer units b and (B) a polymerization initiator. An adhesive resin composition excellent in resistance to soldering heat which contains , (A) a copolymer comprising vinyl monomer units a and epoxy monomer units b and (B') a cationic polymerization initiator characterized in that the melt , viscosity of the composition at 180 ~C and a shear rate of 1.2 x 102 sec-1 is 50 to 1000 Pa s. An adhesive sheeting which is produced by laminating an adhesive resin layer I containing (A) a copolymer comprising vinyl monomer units a and …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 27, 2001. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 27, 2021.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 27, 2023.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.