Mems optical backplane interface

Abstract From the Canadian patent

An optical interface between circuit cards more particularly between optical , paths on a circuit card and a mainboard is manufactured using bulk silicon , micromachining technology. Silicon components of the interface are chemically etched and mass produced at a reduced cost for a higher degree of accuracy and precision than is available for mechanically produced interfaces. By use of micromachining technology to manufacture mating components of an interface dimensional tolerances are possible which cannot be produced with conventional machining techniques. The resulting interface includes a pair of micromachined silicon substrates for mounting on a pair of circuit cards each of the , …