Method of modifying the surface of a semiconductor wafer
CA 2407300 A1 · Owner: Gagliardi, John J. · Inventors: Gagliardi, John J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of modifying a surface of a semiconductor wafer is disclosed. The method includes: (a) contacting the wafer with a fixed abrasive article in the presence of a composition that includes water and a polar component having from 1 to 10 functional groups selected from the group consisting of -OH -, OOH, =O, and combinations thereof, and from 1 to 10 consecutive groups selected from the group consisting of -CH2- -CH2O-, -C2H4O-, -C3H6O- and , combinations thereof; and (b) relatively moving the wafer and the fixed abrasive article to modify the surface of the wafer.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 2, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended October 2, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 2, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.